Unibody contact features on a chassis shell of a mobile device

ABSTRACT

Several embodiments include a mobile device. The mobile device can include a circuit board configured to interconnect one or more electronic components and a chassis shell adapted to form an outer perimeter of the mobile device and to enclose the circuit board. The chassis shell can have an integral unibody that includes a contact feature integral to the chassis shell. A sensor system can be in contact with the chassis shell on an opposite side of the contact feature. The contact feature enables the sensor system to detect touch events when a user interacts with the contact feature.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation of U.S. patent application Ser. No.15/140,444, entitled “UNIBODY CONTACT FEATURES ON A CHASSIS SHELL OF AMOBILE DEVICE,” filed on Apr. 27, 2016, which claims the benefits ofU.S. Provisional Patent Application No. 62/249,130, entitled “MOBILEDEVICES AND MOBILE DEVICE ACCESSORIES,” filed on Oct. 30, 2015, and U.S.Provisional Patent Application No. 62/317,886, entitled “CONTACTFEATURES ON A CHASSIS SHELL OF A MOBILE DEVICE,” filed on Apr. 4, 2016,all of which are incorporated by reference herein in their entirety.

BACKGROUND

A conventional mobile device has various user interactive components,such as buttons and switches. A user interactive component of a mobiledevice generally is exposed on the exterior of the mobile device. Duringthe conventional manufacturing process of a mobile device, a chassisshell of the mobile device is formed with openings. A user interactivecomponent would be inserted through one of the openings and mechanicallycoupled to a sensor system that is coupled to a circuit board of themobile device.

The interface between the opening in the chassis shell and a userinteractive component exposes crevices for dust and other particles toaccumulate. This increases the probability of a mechanical fault of theuser interactive component. The potential misfit between the userinteractive component and the opening of the chassis shell furthercomplicates the manufacturing process and lowers the manufacturing yieldrate.

SUMMARY

Various embodiments include a mobile device with one or more contactfeatures on a chassis shell to serve as interactive components and tofacilitate detection of user interaction events. The contact featurescan include unibody contact features. A unibody contact feature is anintegral part of the chassis shell adapted to enable a sensor system todetect user interactions (e.g., touch events or gestures) occurring onthe unibody contact feature or proximate to the unibody contact feature.The unibody contact features can include bumps, divots, co-moldfeatures, cantilever features, transparent or semitransparent features,or any combination thereof.

A sensor system can be mounted on a side of the chassis shell directlyopposite from a contact feature. In some embodiments, the sensor systemis in direct contact with the chassis shell. For example, the sensorsystem can be an electrical sensor system (e.g., detects patterns inelectrical characteristics on a contact feature), an optical sensorsystem (e.g., detects patterns in visual images of or through a contactfeature), a mechanical force sensor system (e.g., detects patterns inphysical force from the contact feature), or any combination thereof.The sensor system can include a resistive touch sensor and the unibodycontact feature can include multiple electrically conductive portionsexposed on an outer surface of the chassis shell separated by anelectrically non-conductive portion of the outer surface. The sensorsystem can also include a capacitive touch sensor and the unibodycontact feature can include an electrically conductive portion on theouter surface of the chassis shell separated by a dielectric layerunderneath the outer surface.

Some embodiments of a mobile device include a circuit board having aprocessor thereon. The mobile device can include a chassis shell has anintegral unibody including a co-mold loop feature surrounding a button.The co-mold loop feature can be non-conductive and bonded to the buttonand a passive part of the chassis shell. The passive part surrounds theco-mold loop feature. The co-mold loop feature can thereby isolate thebutton from the passive part of the chassis shell surrounding theco-mold loop feature. The button and the passive part of the chassisshell can be composed of a first material (e.g., metallic) differentfrom a second material (e.g., non-metallic) composing the co-mold loopfeature. The co-mold loop feature is exposed on both an exterior sideand an interior side of the chassis shell. A sensor system is coupled tothe circuit board and underneath the button from the interior side ofthe chassis shell. The sensor system can be configured to detect a userinteraction event based on sensor readings from the sensor system. Thesensor system can be configured to register the user interaction eventwith the processor.

Some embodiments of a mobile device include a circuit board having aprocessor thereon and a chassis shell with one or more cut linespatterned thereon to form a cantilever feature. In some embodiments, ahinge region of the cantilever feature can be a cross section smallerthan a partially floating region of the cantilever feature. The hingeregion attaches the partially floating region to the rest of the chassisshell aside from the cantilever feature. The mobile device can have asensor system, coupled to the circuit board, in contact with thecantilever feature. The cantilever feature is over a sensor of thesensor system. The cantilever feature can be in direct contact with orspaced apart from the sensor. For example, the sensor system can be atactile sensor system or an optical sensor system. The sensor system canbe configured to detect a user interaction event in response todetecting a preset pattern in sensor readings from one or more sensorsof the sensor system. In response to detecting the user interactionevent, the sensor system can send the user interaction event to theprocessor. The processor can then respond to the user interaction event.

Some embodiments includes a mobile device comprising a circuit boardhaving a processor thereon and a chassis shell having an integralunibody including a co-mold loop feature surrounding a button. Theco-mold loop feature can be integrally bonded to both the button and apassive part of the chassis shell surrounding the co-mold loop feature.The button can be composed of a first material different from a secondmaterial composing the co-mold loop feature. The mobile device caninclude a sensor system coupled to the circuit board and underneath thebutton from the interior side of the chassis shell. The sensor systemcan be configured to detect a user interaction event based on sensorreadings from the sensor system and to register the user interactionevent with the processor.

Some embodiments include a unibody component of a mobile device. Theunibody component can include a contiguous piece of a first material, anouter piece comprised of at least the first material, and a co-moldfeature made of a second material. The co-mold feature can surround thecontiguous piece to thereby separate the contiguous piece from the outerpiece. The co-mold loop feature can be integrally bonded to both thecontiguous piece and the outer piece. The co-mold feature can becomposed of a second material different from the first material. In oneexample, the first material is electrically conductive and the secondmaterial is substantially electrically insulating. In another example,the second material is electrically conductive and the first material issubstantially electrically insulating. In one example, the unibodycomponent is a chassis of the mobile device and the contiguous piece isan antenna for the mobile phone. In another example, the unibodycomponent is a chassis of the mobile device and the contiguous piece isa button for the mobile phone.

Some embodiments include a method of manufacturing a unibody componentof a mobile device. The method can include machining a channel partwayinto a first side of a metal piece in a pattern surrounding a contiguousportion of the metal piece; injecting resin into the channel; curing theresin; shaving off a layer of the metal piece on a second side oppositefrom the first side to expose the resin; and electrically connecting aninner portion of the metal piece surrounded by the resin to anelectrical component of the mobile device. The cured resin canelectrically isolate the inner portion from an outer portion just beyondthe channel. In some embodiments, the method can further include cuttingthe metal piece into a plurality of pieces including cutting through atleast two distinct locations of the channel. A display can be installedonto the metal piece to hermetically seal a space surrounded by thedisplay and the metal piece.

Some embodiments of this disclosure have other aspects, elements,features, and steps in addition to or in place of what is describedabove. These potential additions and replacements are describedthroughout the rest of the specification.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective plan view of a mobile device, in accordance withvarious embodiments.

FIG. 2 is a block diagram of a mobile device having a chassis shell withunibody features, in accordance with various embodiments.

FIG. 3A is a perspective view of a first example of a mobile devicehaving a chassis shell with one or more cut lines thereon, in accordancewith various embodiments.

FIG. 3B is a perspective view of a second example of a mobile devicehaving a chassis shell with one or more cut lines thereon, in accordancewith various embodiments.

FIG. 3C is a perspective view of a third example of a mobile devicehaving a chassis shell with one or more cut lines thereon, in accordancewith various embodiments.

FIG. 4 is a perspective view of a mobile device having a chassis shellwith co-mold features thereon, in accordance with various embodiments

FIG. 5 is a perspective view of a mobile device having an optical sensorsystem capable of visually detecting user interactions proximate to themobile device, in accordance with various embodiments.

FIG. 6 is a block diagram illustrating a mobile device with aninteractive component, in accordance with various embodiments.

FIG. 7 is a flowchart illustrating a method of manufacturing a mobiledevice with a co-mold feature, in accordance with various embodiments.

FIG. 8A is a top view of a rigid working piece to be formed into achassis shell, in accordance with various embodiments.

FIG. 8B is a cross-sectional side view of the rigid working piece ofFIG. 8A along lines A-A′ of FIG. 8A.

FIG. 8C is a cross-sectional view of the rigid working piece along linesA-A′ of FIG. 8A after machining a channel therein.

FIG. 8D is a cross-sectional view of the rigid working piece along linesA-A′ of FIG. 8A after injecting resin into the channel.

FIG. 8E is a cross-sectional view of a chassis shell formed from therigid working piece along lines A-A′ of FIG. 8A after shaving off alayer of the rigid working piece.

FIG. 8F is a cross-sectional view of the chassis shell along lines A-A′of FIG. 8A after a sensor system is installed.

The figures depict various embodiments of this disclosure for purposesof illustration only. One skilled in the art will readily recognize fromthe following discussion that alternative embodiments of the structuresand methods illustrated herein may be employed without departing fromthe principles of embodiments described herein.

DETAILED DESCRIPTION

Turning now to the figures, FIG. 1 is a perspective plan view of amobile device 100, in accordance with various embodiments. For purposesof illustration, a top cover (e.g., a display) of the mobile device 100is not shown. A chassis shell 102 of the mobile device 100 forms anouter perimeter of the mobile device 100. The mobile device 100 includesa circuit board 104. The chassis shell 102 surrounds and encloses thecircuit board 104. For example, a processor 108 is attached andelectrically coupled to the circuit board 104. A sensor system 112 canalso be attached to the circuit board 104. The sensor system 112 can bein contact with the chassis shell 102 to detect user interactions (e.g.,touch events or gestures events) with one or more contact features 116on the chassis shell 102.

In some embodiments, the sensor system 112 is an electrical sensorsystem (e.g., capacitive touch sensor system and/or resistive touchsensor system). For example, the electrical characteristics sensorsystem can include a capacitive sensor, a resistance sensor, a voltagesensor, a current sensor, or any combination thereof. In someembodiments, the sensor system 112 is a mechanical force sensor system.For example, the mechanical force sensor system can include a straingauge, a pressure sensor, a force transducer, a vibration sensor, amicrophone, or any combination thereof. In some embodiments, the sensorsystem 112 is an optical sensor system. For example, the optical sensorsystem can include a camera, an infrared optical sensor, an opticalsensor for nonvisible spectrum, or any combination thereof. For example,while the contact features 116 are exposed on an exterior side of thechassis shell 102, one or more sensors can respectively be positioned onthe inner side of the chassis shell 102 directly across from the contactfeatures 116. For directional sensors, the sensors can be directedtoward the contact features 116. The sensor system 112 can report andregister a detected user interaction event to the processor 108.

In some embodiments where the sensor system 112 is an optical sensorsystem, the sensor system 112 can include a light source. For example,the light source can be a light source in the visible spectrum, infraredspectrum, or other electromagnetic radiofrequency spectrum. In someembodiments, the light source can be a light emitting diode (LED) or alaser.

Unlike conventional buttons that are separate components inserted intoopenings of a chassis shell, the chassis shell 102 includes one or morecontact features 116 that represent locations where users can interactwith the mobile device 100. The contact features 116 can be integralparts of the chassis shell 102, where these integral parts can bereferred to as “unibody features” or “unibody contact features.” In someembodiments, the contact features 116 are or include bumps or divots onthe chassis shell 102 to inform the user (e.g., visually and/ortactilely) one or more locations on the chassis shell 102 where userinteractions can be registered by the mobile device 100. In someembodiments, the contact features 116 are or include partial cutoutsthat enable regions of the chassis shell 102 that are capable ofbending. The bending enables the sensor system 112 to detect physicalforce or movement. In some embodiments, the contact features 116 are orinclude transparent or semitransparent material to enable an opticalsensor to visually detect patterns (e.g., movement patterns or imagepatterns) representing user interactions. FIGS. 2-5 represent differentexamples of a mobile device (e.g., the mobile device 100) havingdifferent contact features on its chassis shell.

FIG. 2 is a block diagram of a mobile device 200 having a chassis shell202 with unibody features 206, in accordance with various embodiments.The unibody features 206 can be bumps, divots, other concave features,other convex features, or any combination thereof. The unibody features206 are integral to the chassis shell 202. In some embodiments, thechassis shell 202 is composed of a single rigid material (e.g., metal,plastic, carbon fiber, or other rigid material). In these embodiments,the unibody features 206 are composed of the same single rigid material.In some embodiments, the chassis shell 202 is composed of two or morematerials. In these embodiments, the unibody features 206 are composedof the same material as a portion (e.g., a panel surface) of the chassisshell 202 that surrounds the unibody features 206.

Inside the mobile device 200 is an electrical sensor system 210 (shownin dashed lines). The electrical sensor system 210 can detect touchevents based on changes in electrical characteristics (e.g., capacitanceor resistance) of a load. In one example, the electrical sensor system210 is a capacitive sensor system. The capacitive sensor system relieson capacitive coupling to detect a user interaction (e.g., a touchevent). The capacitive sensor system can take into account human bodycapacitance as an input.

In another example, the electrical sensor system 210 is a resistivesensor system. The resistive sensor system can utilize flexible sheetscoated with a resistive material and separated by a gap (e.g., an airgap or micro dots). The resistive sensor system can detect a touch eventat a particular coordinate on the flexible sheets when electricalcontact (e.g., caused by physical force from an external object) is madebetween the two sheets. The external object can be a finger, a stylus, apen, other body parts, or other movable objects.

The electrical sensor system 210 can monitor electrical characteristicreadings (e.g., capacitance variation or resistance/resistivityvariation) at a region of the chassis shell 202 opposite from at leastone of the unibody features 206. In some embodiments, the electricalsensor system 210 can determine, based on the electrical characteristicreadings, when a touch event caused by an external object (e.g., humanfinger) occurred. For example, the electrical sensor system 210 candetermine that a touch event occurred when the external object is incontact with at least one of the unibody features 206 or substantiallyin contact with (e.g., within 3 to 5 millimeter range from) one or moreunibody features 206. In some embodiments, a logic unit (e.g., anadapter, an application-specific integrated circuit, a controller, or aprocessor) determines, based on the capacitive readings, when a touchevent caused by a human finger occurred. In some embodiments, the logicunit is part of the electrical sensor system 210. In some embodiments,the logic unit is separate from the electrical sensor system 210 and acentral processor of the mobile device 200. In some embodiments, thelogic unit is a central processor of the mobile device 200.

In various embodiments, the mobile device 200 with the unibody features206 can be waterproof and/or hermetically sealed. In these embodiments,the unibody features 206 on the chassis shell 202 does not include anyholes and thus prevents exposure the electrical sensor system 210 toliquid substance outside of the chassis shell 202.

FIG. 3A is a perspective view of a first example of a mobile device 300Ahaving a chassis shell 302A with one or more cut lines 306A thereon, inaccordance with various embodiments. The cut lines 306A forms one ormore cantilever features (e.g., cantilever feature 310A and a cantileverfeature 310B, collectively as the “cantilever features 310”). Forexample, the cantilever features 310 can form leaf springs or flatsprings. The cut lines 306A can include one or more straight linesand/or one or more curved lines. In several embodiments, the cut lines306A do not form any loop. In some embodiments, at least one of the cutlines 306A forms a serpentine shape to produce one or more cantileverfeatures shaped as scalloped protrusions. In these embodiments, theserpentine shape enables a single cut line to produce multiplecantilevered features that can serve as spring contact features (e.g.,buttons). In some embodiments, at least one of the cut lines 306A formsa spiral shape (e.g., a circular spiral shape or a rectangular spiralshape) to produce at least a cantilevered feature with a correspondingspiral shape. In these embodiments, the spiral shape enables thecantilevered feature to flex deeper into the mobile device, and hencemore accurately detect pressing of the cantilevered feature by a sensorsystem. Each of the cantilever features 310 can include at least a hingeportion 314 mechanically attaching a partially floating portion 316 tothe chassis shell 302A. The partially floating portion 316 can becantilevered from the hinge portion 314.

Inside the mobile device 300A is a sensor system 318 (e.g., including asensor subsystem 318A (shown in dashed lines) for detecting userinteractions at the cantilever feature 310A and a sensor subsystem 318B(shown in dashed lines) for detecting user interactions at thecantilever feature 310B, collectively the “sensor system 318”). In someembodiments, the sensor subsystem 318A is a mechanical force sensorsystem. In one example, the mechanical force sensor system is in contactwith the partially floating portion 316 at the default/steady state ofthe cantilever feature 310A. When a user exerts a force against thepartially floating portion 316, the partially floating portion 316, inturn, exerts a force against the mechanical force sensor system enablingthe mechanical force sensor system to detect the user interaction. Inanother example, the mechanical force sensor system is slightlyseparated from the partially floating portion 316 at the default/steadystate of the cantilever feature 310A. When a user exerts a force againstthe partially floating portion 316, the partially floating portion 316moves to make contact with the mechanical force sensor system enablingthe mechanical force sensor system to detect the user interaction.

In some embodiments, the sensor subsystem 318A is an optical sensorsystem. The optical sensor system can be spaced apart from the partiallyfloating portion 316. The optical sensor system can direct its opticalsensor toward the partially floating portion 316. In one example, when auser presses against the partially floating portion 316, the partiallyfloating portion 316 moves toward the optical sensor. The optical sensorsystem can detect the movement visually, and register (e.g., with aprocessor) the movement as a user interaction on the cantilever feature310A. In another example, when a user presses against the partiallyfloating portion 316, the user covers up at least some of the cut lines306A, and thus dimming the light received by the optical sensor system.In turn, the optical sensor system can register the dimming as a userinteraction event with the cantilever feature 310A. In some embodiments,the optical sensor system can include a light source to facilitate thevisual detection of a user interaction.

The sensor subsystem 318B can be implemented similarly to the sensorsubsystem 318A. In some embodiments, the sensor subsystem 318A and thesensor subsystem 318B separately communicate with the processor (notshown) of the mobile device 300A. In some embodiments, the sensorsubsystem 318A and the sensor subsystem 318B can consolidate andinterprets data in a shared logic unit (not shown) of the sensor system318 prior to communicating the detected user interactions with theprocessor of the mobile device 300A.

FIG. 3B is a perspective view of a second example of a mobile device300B having a chassis shell 302B with one or more cut lines 306Bthereon, in accordance with various embodiments. The cut lines 306B caninclude one or more serpentine shape cut lines that produce one or morescalloped cantilever features.

FIG. 3C is a perspective view of a third example of a mobile device 300Chaving a chassis shell 302C with one or more cut lines 306C thereon, inaccordance with various embodiments. The cut lines 306C can include oneor more spiral shape cut lines that produce spiral shape cantileverfeatures.

FIG. 4 is a perspective view of a mobile device 400 having a chassisshell 402 with co-mold features (e.g., a co-mold feature 406A and aco-mold feature 406B, collectively as the “co-mold features 406”)thereon, in accordance with various embodiments. In some embodiments,the co-mold features 406 are the unibody features 206 of FIG. 2. In someembodiments, the mobile device 400 can be made via the method 700 ofFIG. 7. Co-mold is a type of molding over an existing part. For example,a first part can be placed into a mold, and a resin is injected into andaround the first part to form a second part. A co-mold feature is aunibody contact feature integral to the chassis shell 402, where theco-mold feature is composed of one or more materials different from thematerial surrounding it.

In several embodiments, the chassis shell 402 is comprised of at leasttwo material (e.g., metallic and nonmetallic). The co-mold features 406can be nonmetallic. For example, the co-mold features 406 can includeelastomer or plastic. The co-mold features 406 can be sandwiched betweenmetallic parts of the chassis shell 402. The co-mold features 406 can bebonded (e.g., after curing a molded resin) to the metallic parts of thechassis shell 402 that the co-mold features 406 are in contact with, andthus making the chassis shell 402 an integral body. The co-mold features406 can be exposed from the metallic parts of the chassis shell 402 ontwo opposite sides (e.g., an exterior and an interior of the chassisshell 402). The co-mold features 406 can be held together by all othersides (e.g., perpendicular sides from the exposed sides) by adjacentmetallic parts of the chassis shell 402. In some embodiments, theco-mold features 406 are shaped in a loop or a ring that electricallyisolate one or more metallic buttons 408 from the rest of the chassisshell 402. In other embodiments, the co-mold features 406 arenon-looping features.

Inside of the mobile device 400 and the chassis shell 402 includes atleast a touch sensor system 410 (shown in dashed lines), such as anelectrical sensor system, a mechanical force sensor system/tactilesensor system, an optical sensor system, or any combination thereof. Insome embodiments, the touch sensor system 410 is the electrical sensorsystem 210. The touch sensor system 410 can include a capacitive sensor,a resistive sensor, a mechanical force sensor, an optical sensor, or anycombination thereof. The touch sensor system 410 can monitor sensorreadings (e.g., capacitance variation, resistance/resistivity variation,optical image variation, mechanical force variation, or any combinationthereof) at metallic buttons 408 and/or the co-mold features 406. Forexample, the touch sensor system 410 can determine that a touch eventoccurred when the external object is in contact or substantially incontact with at least one the metallic buttons 408 and/or the co-moldfeatures 406. In some embodiments, the touch sensor system 410 is anoptical sensor system. The material of the co-mold features 406 can besemi-transparent or transparent to enable the optical sensor system todetect a touch event or a gesture event occurring beyond the co-moldfeatures 406.

In some embodiments, a logic unit (e.g., an adapter, anapplication-specific integrated circuit, a controller, or a processor)determines, based on the sensor readings, when a touch event causedoccurred. In some embodiments, the logic unit is part of the touchsensor system 410. In some embodiments, the logic unit is outside of thetouch sensor system 410.

FIG. 5 is a perspective view of a mobile device 500 having an opticalsensor system 502 (shown in dashed lines) capable of visually detectinguser interactions proximate to the mobile device, in accordance withvarious embodiments. In some embodiments, the mobile device 500 is themobile device 400 of FIG. 4. The mobile device 500 includes a chassisshell 506 having one or more non-opaque features (e.g., a non-opaquefeature 510A and a non-opaque feature 510B, collectively as the“non-opaque features 510) thereon. The non-opaque features can betransparent or at least partially transparent to enables the opticalsensor system 502 to detect visual movements therethrough. In someembodiments, the non-opaque features 510 are unibody features integralto the chassis shell 506. In some embodiments, the non-opaque features510 are inserts through the openings of the chassis shell 506.

The optical sensor system 502 detects images of one or more objectsoutside of the mobile device 500. For example, unlike some embodimentsof the touch sensor system 410 that utilizes an optical sensor, theoptical sensor system 502 detects images through the non-opaque features510 instead of the images of the non-opaque features 510. In someembodiments, the optical sensor system 502 determines a user interactionevent based on image analysis of one or more captured images. In someembodiments, the optical sensor system 502 determines a user interactionevent based on video analysis of a sequence of one or more imagescaptured by the optical sensor system 502. For example, the userinteraction event can be a touch event or a user gesture event. Theoptical sensor system 502 can register the touch events with a processor(not shown). In some embodiments, the optical sensor system 502 candetect images in the visual spectrum. In some embodiments, the opticalsensor system 502 can detect images outside of the visual spectrum, suchas infrared spectrum.

In some embodiments, the optical sensor system 502 includes a lightsource. For example, the optical sensor system 502 can include aninfrared light emitter, a light-emitting diode, a laser, or anycombination thereof.

FIG. 6 is a block diagram illustrating a mobile device 600 with acontact feature 602, in accordance with various embodiments. The mobiledevice 600 can be the mobile device 100, the mobile device 200, themobile device 300, the mobile device 400, the mobile device 500, or anycombination thereof. The mobile device 600 can include a display 604, achassis shell 606, a processor 610, a circuit board 612 (e.g., a circuitboard), one or more electronic components 614 (e.g., including a sensorsystem 618), or any combination thereof. For example, the sensor system618 can be an electrical characteristic sensor system, an optical sensorsystem, a mechanical force sensor system (e.g., a tactile sensorsystem), or any combination thereof.

The chassis shell 606 can be adapted to protect the electroniccomponents 614 and the processor 610. The circuit board 612 can hold andsupport the processor 610 and the electronic components 614. In someembodiments, the circuit board 612 provides electrical interconnectionfor the electronic components 614. The display 604 can be attached overthe circuit board 612. The chassis shell 606 can be adapted to form anexterior of the mobile device 600 and to protect the electroniccomponents 614 therein. The chassis shell 606 can expose at least partof the display 604. In some embodiments, the display 604 is atouchscreen. The chassis shell 606 and the exposed portion of thedisplay 604 can form a substantially sealed exterior of the mobiledevice 600.

The chassis shell 606 includes the contact feature 602. In someembodiments, the chassis shell 606 includes multiple contact features.In some embodiments, the contact feature 602 is unibody feature (e.g.,one of the unibody features 206) that is mechanically integral to therest of the chassis shell 606. In one example, the contact feature 602includes one or more bumps or divots on the chassis shell 606. In someembodiments, the contact feature 602 is a cantilever feature (e.g., oneof the cantilever features 310). In some embodiments, the contactfeature 602 includes a co-mold feature (e.g., one of the co-moldfeatures 406). In some embodiments, the contact feature 602 includesnon-opaque features (e.g., one of non-opaque features 510).

In some embodiments, the sensor system 618 monitors raw data from insidethe chassis shell 606. One or more sensors (e.g., a sensor 630A and asensor 630B, collectively as the “sensors 630”) can be directed towardor in contact with the contact feature 602. In some embodiments, a logicunit 634 of the sensor system 618 identifies user interaction events bydetecting patterns in the raw data. Upon identifying a user interactionevent, the logic unit 634 can send an interrupt message, indicating theuser interaction event, to an operating system implemented by theprocessor 610.

In some embodiments, the sensor system 618 sends the raw data to theprocessor 610. The processor 610 can implement an operating system. Inthese embodiments, the processor 610 (e.g., a driver implemented by theprocessor 610) identifies a user interaction event by detecting patternsin the raw data. The processor 610 can then issue an interrupt messageto the operating system to indicate that the user interaction event hasoccurred.

In some embodiments, the sensor system 618 includes other devices tofacilitate user interactions with the mobile device 100. For example,the sensor system 618 can include one or more feedback devices 638, suchas a piezo-electric feedback device, a transducer feedback device, avibration motor, or any combination thereof. The feedback devices 638can generate a mechanical force on the chassis shell 606 to indicatethat the sensor system 618 has registered a user interaction on thecontact feature 602. The mechanical force can be localized around thecontact feature 602 on which the user interaction is registered.

Each of the components (e.g. the mechanical and/or electroniccomponents) associated with the mobile device 600 may operateindividually and independently of other components of the mobile device600. Some or all of the components may be mechanically attached to orcoupled to one another to form a single apparatus. Electronic componentscan be coupled through one or more communication channels (e.g.,wireless or wired channel) to coordinate their operations. Some or allof the components may be combined as one component. A single componentmay be divided into sub-components, each sub-component performingseparate function or functions of the single component. The mobiledevice 600 described may include additional, fewer, or differentcomponents (e.g., mechanical, electrical, functional, logical, and/ordecorative components) for various applications.

FIG. 7 is a flowchart illustrating a method 700 of manufacturing amobile device (e.g., the mobile device 400) with a co-mold feature, inaccordance with various embodiments. FIGS. 8A-8F illustratecross-sections of a rigid working piece undergoing the manufacturingmethod 700 of FIG. 7, in accordance with various embodiments. Forexample, FIG. 8A is a top view of a rigid working piece 800A to beformed into a chassis shell, in accordance with various embodiments. Atarget region 802 (shown in dashed lines) illustrates the intendedregion where a metallic button surrounded by a co-mold feature is toform via the method 700. The area bounded by the dashed linesillustrates the intended region of the metallic button. The area boundedbetween the dashed lines and the dotted lines illustrate the intendedregion of the co-mold feature. FIG. 8B is a cross-sectional side view ofthe rigid working piece 800A of FIG. 8A along lines A-A′ of FIG. 8A. Therigid working piece 800A can be comprised of metallic material,non-metallic material, or a combination thereof. The rigid working piece800A can be in any state of completeness, from a raw block of materialto a nearly finished shape of the chassis shell.

At step 702, a manufacturer can machine a channel at least partiallyinto a first side of a rigid working piece according to a profile of abutton. For example, the manufacturer can use a laser machine or acomputerized numeric control (CNC) mill to form the channel. FIG. 8C isa cross-sectional view of a rigid working piece 800C along lines A-A′ ofFIG. 8A after machining a channel 806 in the rigid working piece 800A ofFIG. 8A. The channel 806 is formed as a result of step 702.

At step 704, the manufacturer can inject resin into the channel. Forexample, the resin can be a nonconductive material (e.g., plastic,epoxy, elastomer, etc.). The resin can be anodized metal oxide orceramitized metal. In some embodiments, resin is injected into thechannel until the height of the resin aligns with the top surface of thefirst side of the rigid working piece. The resin can be an adhesivematerial. FIG. 8D is a cross-sectional view of the rigid working piece800D along lines A-A′ of FIG. 8A after injecting resin into the channel806 of the rigid working piece 800C (e.g., after step 704). A co-moldfeature 810 can formed within the space of the channel 806. Step 704 canbe performed as part of a co-mold process (i.e., any type of moldingover an existing part). In one example, the co-mold process can be anover mold process. In an over mold process, a mold with a single cavityis used. The rigid working piece 800C would be placed into the singlecavity of the mold, and the resin is injected over the rigid workingpiece 800C within the single cavity. In another example, the co-moldprocess can be a double shot process. A mold with two cavities is usedin the double shot process. A first cavity of the mold is used tomanufacture the rigid working piece 800A (e.g., before step 702), and asecond cavity of the mold is used to inject the resin into the channelof the rigid working piece 800C after the channel is formed. In thatexample, the rigid working piece 800A can be formed from a plasticmaterial.

At step 706, the manufacturer can cure the resin such that the resinhardens and forms a bond with metal parts immediately adjacent to thechannel. At step 708, the manufacturer can shave off a layer of therigid working piece on a second side opposite from the first side toexpose the hardened resin. For example, step 708 can be performed by asubtractive process, such as CNC machining, grinding, electricaldischarge machining (EDM), punching, laser cutting, waterjet cutting, orany combination thereof. In some embodiments, the shaving of the layeris localized within a region opposite from the channel. FIG. 8E is across-sectional view of a chassis shell 800E formed from the rigidworking piece 800D along lines A-A′ of FIG. 8A after shaving off a layerof the rigid working piece 800D (e.g., after step 708). Although FIG. 8Eillustrates the result of a localized shaving of the second side of therigid working piece 800D, in other embodiments, the entire second sideof the rigid working piece 800D can be shaven off. In severalembodiments, the rigid working piece 800D is formed into the chassisshell 800E of a mobile device after step 708.

In some embodiments, the co-mold feature 810 takes the form of a ringaround a button profile. In these embodiments, the co-mold feature 810holds an inner metal button 816 and the rest of the chassis shelltogether while electrically isolating the inner metal button 816. Insome embodiments, there is no inner metal button and the co-mold feature810 takes the form of a button profile (e.g., instead of a loop or ringshape). In these embodiments, the co-mold feature 810 is attached to therest of the chassis shell and acts as a button (e.g., tactile, optical,resistive, and/or capacitive button) for the mobile device.

At step 710, the manufacturer can install a sensor system 820 (e.g., acapacitive sensor system, a resistive sensor system, an optical sensorsystem, or any combination thereof) on the second side (e.g., oppositefrom the original mouth of the channel) of the rigid working piece. Thesensor system can be used to detect touch events. FIG. 8F is across-sectional view of the chassis shell 800E along lines A-A′ after asensor system 820 is installed. In some embodiments, the sensor system820 is directly attached to the chassis shell 800E. In some embodiments,the sensor system 820 is attached to a support frame, which ismechanically bound within the chassis shell formed from the chassisshell 800E. In various embodiments, the sensor system 820 can includesensors directed at and/or in contact with the inner metal button 816and/or the co-mold feature 810.

In various embodiments, the manufacturing process of the method 700 isapplicable to construct a hermetically sealed structure (e.g., thechassis shell 800E) with both an electrically conductive portion and anelectrically nonconductive portion. This hermetically sealed structurecan be the chassis shell of a mobile device. The conductive portion canbe a contact feature, representing a button, or other functional pieceusable by one or more electrical systems of the mobile device. Forexample, the conductive portion can be metallic, carbon fiber, etc., orany combination thereof, and the non-conductive portion can be ceramic,glass, silicone, etc., or any combination thereof.

While processes or blocks are presented in a given order in thisdisclosure, alternative embodiments may perform routines having steps,or employ systems having blocks, in a different order, and someprocesses or blocks may be deleted, moved, added, subdivided, combined,and/or modified to provide alternative or subcombinations. Each of theseprocesses or blocks may be implemented in a variety of different ways.In addition, while processes or blocks are at times shown as beingperformed in series, these processes or blocks may instead be performedin parallel, or may be performed at different times.

Some embodiments of the disclosure have other aspects, elements,features, and steps in addition to or in place of what is describedabove. These potential additions and replacements are describedthroughout the rest of the specification. Reference in thisspecification to “various embodiments,” “several embodiments,” “someembodiments” means that a particular feature, structure, orcharacteristic described in connection with the embodiment is includedin at least one embodiment of the disclosure. Alternative embodiments(e.g., referenced as “other embodiments”) are not mutually exclusive ofother embodiments. Moreover, various features are described which may beexhibited by some embodiments and not by others. Similarly, variousrequirements are described which may be requirements for someembodiments but not other embodiments.

What is claimed is:
 1. A mobile device, comprising: a circuit boardconfigured to interconnect one or more electronic components; a display;a chassis shell adapted to form an outer perimeter of the mobile device,to hold the display, and to enclose the circuit board, wherein thechassis shell includes a unibody contact feature integral to the chassisshell; and a sensor system in contact with the chassis shell on anopposite side of the unibody contact feature, wherein the unibodycontact feature enables the sensor system to detect touch events when auser interacts with the unibody contact feature.
 2. The mobile device ofclaim 1, wherein the sensor system is an optical sensor system and theunibody contact feature is a transparent or semi-transparent portion ofthe chassis shell.
 3. The mobile device of claim 1, wherein the sensorsystem is a resistive touch sensor and the unibody contact featureincludes an electrically conductive portion and an electricallynon-conductive portion.
 4. The mobile device of claim 1, wherein thesensor system is a capacitive touch sensor and the unibody contactfeature includes an electrically conductive portion and an electricallynon-conductive portion.
 5. A mobile device, comprising: a circuit boardconfigured to interconnect one or more electronic components; a chassisshell adapted to form an outer perimeter of the mobile device and toenclose the circuit board, wherein the chassis shell includes a contactfeature integral to the chassis shell; and a sensor system in contactwith the chassis shell on an opposite side of the contact feature, thesensor system comprising one or more sensors, wherein the contactfeature enables the sensor system to detect touch events when a userinteracts with the contact feature.
 6. The mobile device of claim 5,wherein the contact feature includes a co-mold feature composed anon-conductive material that electrically isolates an inner metallicbutton surrounded by the co-mold feature.
 7. The mobile device of claim5, wherein the sensor system is an optical sensor system, a capacitivetouch sensor system, a resistive touch sensor system, a tactile touchsensor system, or any combination thereof.
 8. The mobile device of claim5, wherein the contact feature is a cantilever feature formed from a cutline on the chassis shell.
 9. The mobile device of claim 8, wherein thecantilever feature is a first cantilever feature and the sensor is afirst sensor, and wherein the cut line forms a second cantilever featureover a second sensor of the sensor system.
 10. The mobile device ofclaim 8, wherein the cantilever feature is in direct contact with thesensor.
 11. The mobile device of claim 8, wherein the sensor system is atactile sensor system configured to detect mechanical force exerted bythe cantilever feature when an external force pushes against thecantilever feature.
 12. The mobile device of claim 8, wherein the cutline includes at least a curved portion.
 13. The mobile device of claim8, wherein the cantilever feature is spaced part from the sensor system.14. The mobile device of claim 8, wherein the sensor system is anoptical sensor system capable of detecting movement of the cantileverfeature when an external force bends the cantilever feature, and whereinthe sensor system is configured to detect a user interaction event inresponse to detecting a preset pattern in a movement pattern of thecantilever feature.
 15. The mobile device of claim 8, wherein the sensorsystem is an optical sensor system capable of detecting dimming of lightthrough the cut line, and wherein the sensor system is configured todetect a user interaction event in response to detecting a presetpattern in the dimming of light through the cut line.
 16. The mobiledevice of claim 8, wherein a hinge region of the cantilever feature hasa cross section smaller than a partially floating region of thecantilever feature; and wherein the hinge region attaches the partiallyfloating region to rest of the chassis shell aside from the cantileverfeature.
 17. The mobile device of claim 8, wherein the cut line has aserpentine shape and the cantilever feature is a scalloped protrusion.18. The mobile device of claim 8, wherein the cut line and thecantilever feature have spiral shapes.
 19. The mobile device of claim18, wherein the spiral shapes include a rectangular spiral shape.